DDR3メモリー展示館 tanuki記 2008.12.3-
■チップ
| Maker | Samsung | Hynix | Elpida | Micron | PQI |
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| Density | 1Gb | 1Gb | 1Gb | 1Gb | 512Kb |
| Package size(mm) | 9.0ｘ11.0 | 8.0ｘ11.5 | 8.6ｘ13.0 | 9.0ｘ11.5 | 10.0x16.0 |
| Number | K4B1G0846D | H5TQ1G83AFP | EDJ1108BASE | MT41J128M8 | PQC3648S |
| DDR3-1066 CL7 | HCF8 | G7C | AE-E | HX-187E:D(D9JNL) | |
| DDR3-1333 CL9 | HCH9 | H9C | DJ-E | HX-15E:D(D9JNM) | 15R |
| Maker | Elpida | Micron | KingMax | ||
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| Density | 1Gb | 1Gb | 1Gb | ||
| Package size(mm) | 8.6ｘ13.0 | 9.0ｘ15.5 | 9.0ｘ13.0 | ||
| Number | EDJ1108BABG | MT41J128M8 | KFB8FNGXF | ||
| DDR3-1066 CL7 | AE-E | BY-187E:B(D9GTR) | |||
| DDR3-1333 CL9 | DJ-E | BY-15E:B(D9GTS) | ANX-15U |
■基板
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